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Thin MEMS microphone based on package-integrated fabrication process

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PROJECT TITLE :

Thin MEMS microphone based on package-integrated fabrication process

ABSTRACT :

A skinny capacitive-type MEMS acoustic sensor fabricated employing a totally package-integrated process is presented. This sensor contains a very slim thickness of one hundred fifty μm because of the elimination of the sophisticated backside alignment process which needs a thickness of more than 400 μm to forestall the substrate from breaking down. Likewise, a structure-primarily based equivalent circuit modelling was performed to evaluate the characteristics of the proposed microphone. The measured initial gap was two.eight μm, which resulted in an intrinsic capacitance of zero.89 pF and also the natural frequency was 83 kHz. The sensor has an opencircuit sensitivity of -47.seven dBV/Pa at 1 kHz with 10.4 V. The modelled sensitivity shows sensible agreement with the measured sensitivity.


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Thin MEMS microphone based on package-integrated fabrication process - 4.7 out of 5 based on 94 votes

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