A Shielding Structure for Crosstalk Reduction in Silicon Interposer


High-density interconnects together with redistribution layers (RDLs) and through-silicon-vias (TSVs) in silicon interposer need effective crosstalk-reduction signaling schemes. During this letter, a novel ground RDL lines structure utilizing ohmic contact is proposed for coupling mitigation, where the conventional insulator layer between the silicon substrate and the ground RDL lines is removed. Identical circuit model is developed to capture the coupling reduction mechanism. The proposed structure is then verified by the complete-wave simulations. Finally, a check sample is fabricated and measured. The measurement results show a smart correlation with those of the developed equivalent circuit model.

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