PROJECT TITLE :

Reliability Analysis and Redundancy Configuration of MMC With Hybrid Submodule Topologies

ABSTRACT:

Modular multilevel converter (MMC) has become the most promising converter technology for prime-voltage direct current (HVdc) transmission systems. MMC submodule (SM) topologies with dc fault ride-through capabilities are rising which are appropriate for overhead line applications. The hybrid SM design of each converter arm will get the compromise of higher capability of handling dc fault and lower capital investments and losses. During this paper, the initial hybrid SM numbers style methodology for supporting the dc-link voltage and riding-through dc faults and the optimized hybrid SM redundancy configuration strategy for effectively increasing the reliability of MMC are proposed and calculated. In distinction with the previously proposed redundancy configuration for MMC with the one SM topology, this approach solves the curvature of three-dimensional surface to calculate the recommended redundant hybrid SM numbers which takes both the semiconductor device utilization rate and the reliability of MMC into thought.


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