PROJECT TITLE :
3D-Printed Origami Packaging With Inkjet-Printed Antennas for RF Harvesting Sensors
This paper demonstrates the mixture of additive producing techniques for realizing complicated 3D origami structures for high frequency applications. A 3D-printed compact package for enclosing radio frequency (RF) electronics is constructed, that features on-package antennas for RF signal reception (for harvesting or communication) at orthogonal orientations. Conventional 3D printing technologies often require significant amounts of your time and supporting material to appreciate bound structures, such as hollow packages. During this work, rather than fabricating the package in its final 3D type, it is 3D-printed as a planar structure with “good” form-memory hinges that enable origami folding to a 3D form when heating. This significantly reduces fabrication time and effectively eliminates the requirement for supporting material, so minimizing the overall manufacturing value. Metallization on the package is performed by directly inkjet printing conductive inks on high of the 3D-printed surface with a modified inkjet-printed method without the necessity for surface treatment or processing. Inkjet-printed on-package conductive features are successfully fabricated, that are combined with RF energy harvesting electronics to showcase the proof-of-concept of utilizing origami techniques to build fully 3D RF systems. The methodologies presented in this paper can be enabling the producing of numerous real-time shape-changing 3D advanced structures for electromagnetic applications.
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