PROJECT TITLE :

Compact Thermal Failure Model for Devices Subject to Electrostatic Discharge Stresses

ABSTRACT:

A leading reason behind device failure beneath electrostatic discharge stress conditions is thermal failure. This failure occurs as a results of excessive energy dissipation which raises the temperature of the device to a important breaking level. To predict such a physical failure at circuit level, a compact model compatible with circuit simulators is proposed. The model comes from the elemental heat transfer equations and is shown to accurately predict thermal failure for arbitrary electrical stress waveforms.


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