PROJECT TITLE :
A Correlation-Considered Variation-Aware Interconnect Parasitic Profile Extraction Method
This paper presents a unique technique of performing correlation-considered statistical interconnect parasitic parameter extraction on 40-nm method technology. 5 test structures are designed for the extraction. Then, three-D simulations are performed, and typical interconnect technology profile (ITP) file is extracted. Based mostly on the complete mapping measurements of take a look at structures, their distribution analysis, and notably the correlations between parasitic coupling capacitance of each metal layer, statistical parameters are extracted using principal-component-analysis technique. Then, an entire flow of correlation-considered variation-aware ITP file extraction is concluded. In line with the comparison between distributions of Monte Carlo simulations and measurements of output signal periods of ring oscillators, the extracted statistical ITP is proved to be accurate.
Did you like this research project?
To get this research project Guidelines, Training and Code... Click Here