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Reliability Improvement of 28-nm High- /Metal Gate-Last MOSFET Using Appropriate Oxygen Annealing

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PROJECT TITLE :

Reliability Improvement of 28-nm High- /Metal Gate-Last MOSFET Using Appropriate Oxygen Annealing

ABSTRACT :

In this letter, performance and reliability of high-$k$ /metal gate MOSFETs can be effectively improved using postmetallization annealing. Both oxygen and nitrogen were shown to diffuse into a high-$k$/$hboxSiO_2$ interfacial layer to suppress the formation of oxygen vacancy, thus reducing the gate leakage current while not increasing effective oxide thickness. In explicit, with appropriate oxygen annealing, gate-induced drain leakage, drain-current degradation, and gate leakage current variation of high- $k$/metal gate-last MOSFETs can be efficiently suppressed.


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Reliability Improvement of 28-nm High- /Metal Gate-Last MOSFET Using Appropriate Oxygen Annealing - 4.8 out of 5 based on 72 votes

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