PROJECT TITLE :

Redistribution of Electrical Interconnections for Three-Dimensional Wafer-Level Packaging With Silicon Bumps

ABSTRACT :

During this letter, an approach to the redistribution of electrical interconnections is investigated for potential application in 3D wafer-level packaging. A cap wafer with silicon bumps and electrical feedthroughs is bonded along with a tool wafer using wafer-level glass-frit bonding technology. Throughout the bonding process, the mechanical bond is performed by glass-frit bonding to form hermetic packaging. Simultaneously, the silicon bumps provide close contact for the electrical feedthroughs on the cap wafer and the metal pads on the device wafer, on that a gold–aluminum eutectic is made to attain electrical interconnections between the cap wafer and also the device wafer. Moreover, the silicon bumps provide a means to manage well the height of the bonding materials. This process not only realizes a wafer-level hermetic sealing however also achieves the redistribution of electrical interconnections. Application of this approach for a high performance MEMS resonator is demonstrated, that illustrates the feasibility of this process.


Did you like this research project?

To get this research project Guidelines, Training and Code... Click Here


PROJECT TITLE :Attack Vulnerability of Power Systems Under an Equal Load Redistribution Model - 2018ABSTRACT:This Project studies the vulnerability of flow networks against adversarial attacks. In specific, take into account a
PROJECT TITLE :Delivery of ATSC 3.0 Services With MPEG Media Transport Standard Considering Redistribution in MPEG-2 TS FormatABSTRACT:MPEG-2 transport stream (TS), standardized by the ISO/IEC as part of the well-known MPEG-2
PROJECT TITLE :Structural, Electrical, and UV Detection Properties of ZnO/Si Heterojunction DiodesABSTRACT:This paper reports the structural, electrical, and ultraviolet (UV) light-weight detection properties of n-ZnO/p-Si heterojunction
PROJECT TITLE :Passive charge redistribution digital-to-analogue multiplierABSTRACT:A digital-to-analogue multiplier based on the principle of passive charge sharing and redistribution is proposed. The circuit generates a voltage
PROJECT TITLE : Multi-Core Embedded Wireless Sensor Networks Architecture and Applications - 2014 ABSTRACT: Technological advancements in the silicon industry, as predicted by Moore's law, have enabled integration of billions

Ready to Complete Your Academic MTech Project Work In Affordable Price ?

Project Enquiry