An Interconnect Reliability-Driven Routing Technique for Electromigration Failure Avoidance


As VLSI technology enters the nanoscale regime, style reliability is becoming increasingly vital. A significant design reliability concern arises from electromigration that refers to the transport of material caused by ion movement in interconnects. Since the lifetime of an interconnect drastically depends on the present flowing through it, the electromigration downside aggravates with increasingly growing thinner wires. Further, this-density-induced interconnect thermal issue becomes much a lot of severe with larger current. To mitigate the electromigration and the current-density-induced thermal effects, interconnect current density wants to be reduced. Assigning wires to thick metals increases wire volume, and thus, reduces this density. But, overstretching thick-metal assignment could hurt routability. Thus, it's highly desirable to minimize the thick-metal usage, or total wire cost, subject to the reliability constraint. During this paper, the minimum cost reliability-driven routing, that consists of Steiner tree construction and layer assignment, is considered. The problem is proven to be NP-hard and a highly effective iterative rounding-primarily based integer linear programming algorithm is proposed. In addition, a unified routing technique is proposed to directly handle multiple current levels, that is important in analog VLSI style. Any, the new algorithm is extended to handle blockage. Our experiments on 450 nets demonstrate that the new algorithm significantly outperforms the state-of-the-art work [CHECK FINISH OF SENTENCE] with up to fourteen.7 percent wire reduction. In addition, the new algorithm can save 11.four % wires over a heuristic algorithm for handling multiple currents.

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