PROJECT TITLE:

New Applications of an Automated System for High-Power LEDs

ABSTRACT:

An automatic system based on thermoelectric cooler (TEC), a microfan, and microcontroller is 1st applied to thermal management of high-power light-emitting diodes (LEDs). Its hardware consists of microcontroller as a management core, K-kind thermocouples as acquisition devices, and TEC and a microfan with heatsink as cooling vehicles. The experiment confirms that the LEDs substrate temperature will be controlled effectively, and indicates that the LED chips are operating reliably. Specifically, in high-temperature environments of forty three °C, the system can automatically drop to the low set temperature (thirty °C) thanks to thermoelectric impact driven by TEC. Heat transfer analysis shows that most LED power cooled by the system is 106.7 W, and the total power consumption of the automatic cooling system is solely eight.eighty five W. The automated cooling system contains a high cooling efficiency.


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