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    Components, Packaging and Manufacturing Technology

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    Quasi-Axial GRIN Lens Implemented in Wedge-Shaped Fiber Coupling With InP-Based PLC
    Compact 60-GHz IPD-Based Branch-Line Coupler for System-on-Package V-Band Radios
    A Compact and Embedded Balanced Bandpass Filter With Wideband Common-Mode Suppression on Wireless SiP
    3- to 5-GHz Ultra-Compact Bandpass Filter With Independent Transmission Zeros Using PCB Embedding Passive Technology
    40 Flip-Chip Process Using Ag–In Transient Liquid Phase Reaction
    High-Conductivity Adhesive for Light-Emitting Diode Die-Attachment by Low-Temperature Sintering of Micrometer-Sized Ag Particles
    Thermal Management of Power Inverter Modules at High Fluxes via Two-Phase Spray Cooling
    A Closed-Form Multiscale Thermal Contact Resistance Model
    Efficient Wafer-Level Edge-Tracing Technique for 3-D Interconnection of Stacked Die
    Fabrication and Characterization of Flexible Ultrathin Chip Package Using Photosensitive Polyimide
    Study of Optimal Dummy Fill Modes in Chemical–Mechanical Polishing Process
    Color Biological Features-Based Solder Paste Defects Detection and Classification on Printed Circuit Boards
    Theoretical Analysis of the Deflection of a Cantilever Plate for Wirebonding on Overhang Applications
    Finite Element Modeling and Analysis of Surface Acoustic Wave Devices in CMOS Technology
    Highly Reliable and Manufacturable Ultrafine Pitch Cu–Cu Interconnections for Chip-Last Embedding With Chip-First Benefits
    Predicting the Effect of Underfill Filler Volume Fraction on Solder Fatigue Life and Residual Stress for Surface Mount Components Using Nonlinear Viscoelastic Analyses
    Fabrication of Electronic Packaging Grade Cu–W Materials by High-Temperature and High-Velocity Compaction
    Bended Differential Transmission Line Using Compensation Inductance for Common-Mode Noise Suppression
    Stochastic Modeling-Based Variability Analysis of On-Chip Interconnects
    Multiscale, Multiphysics Model of Underfill Flow for Flip-Chip Packages
    Study on the Near Field Characteristic of Antenna in Package
    Effects of Slurry in Cu Chemical Mechanical Polishing (CMP) of TSVs for 3-D IC Integration
    Studies on the Polymer Adhesive Wafer Bonding Method Using Photo-Patternable Materials for MEMS Motion Sensors Applications
    Low-Cost Thin Glass Interposers as a Superior Alternative to Silicon and Organic Interposers for Packaging of 3-D ICs
    Compact Thermal Resistor-Capacitor-Network Approach to Predicting Transient Junction Temperatures of a Power Amplifier Module
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